Multi-story power delivery for supply noise reduction and low voltage operation
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
Power Distribution Network Design for VLSI
Power Distribution Network Design for VLSI
A multi-story power delivery technique for 3D integrated circuits
Proceedings of the 13th international symposium on Low power electronics and design
Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Power distribution paths in 3-D ICS
Proceedings of the 19th ACM Great Lakes symposium on VLSI
Design automation for a 3DIC FFT processor for synthetic aperture radar: a case study
Proceedings of the 46th Annual Design Automation Conference
Placement of thermal vias in 3-D ICs using various thermal objectives
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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3-D integration has the potential to increase performance and decrease energy consumption.However, there aremany unsolved issues in the design of these systems. In this work we study the design of 3-D power supply networks and demonstrate a technique specific to 3-D systems that improves IR-drop and dynamic noise over a straightforward extension of traditional design techniques. Previous work in 3-D power delivery network design has simply extended 2-D techniques by treating through-silicon vias (TSVs) as extensions of the C4 bumps. By exploiting the smaller size and much higher interconnect density possible with TSVs we demonstrate significant reduction of nearly 50% in the IR-drop and 42% in the dynamic noise of our large-scale 3-D design. Simulations also show that a 3-tier stack with the distributed TSV topology actually lowers IR-drop by 21% and dynamic noise by 32% over a non-3-D system with less power dissipation. We analyze the power distribution network of an envisioned 1000-core processor with 30 stacked dies and show scaling trends related to both increased stacking and power distribution TSVs. Finally, we examine several techniques for minimizing IR-drop and dynamic noise and their effects on our large-scale 3-D system.