Spatial distribution measurement of dynamic voltage drop caused by pulse and periodic injection of spot noise

Authors:
Kan Takeuchi;Masaki Shimada;Takao Sato;Yusaku Katsuki;Hiroumi Yoshikawa;Hiroaki Matsushita
Affiliations:
Renesas Electronics Corporation, Tokyo, Japan;Renesas Electronics Corporation, Tokyo, Japan;Hitachi ULSI Systems Co., Ltd., Fukuoka, Japan;Hitachi ULSI Systems Co., Ltd., Fukuoka, Japan;Hitachi ULSI Systems Co., Ltd., Fukuoka, Japan;Renesas Electronics Corporation, Tokyo, Japan
Venue:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Year:
2013

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Abstract

This paper presents measured results of dynamic voltage drop caused by pulse and periodic injection of spot noise. The test structure being fabricated by a 45 nm low-power process has 1024 delay probes to measure spatial distributions in response to the spot-noise generation. The test structure is the advanced version of our predecessor being fabricated by a 65-nm node, and can trace changes in the spatial distributions with time after the noise injection. The measured results are compared with SPICE simulations, in which package/socket LCR as well as power-line RC within the die is modeled. It is found that the simple model agrees well with the measured results.