Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process

  • Authors:
  • Changhyun Lee;Jonghoon Park;Jinho Yoo;Hyungjun Cho;Jungi Choi;Jeongho Cho;Changkun Park

  • Affiliations:
  • -;-;-;-;-;-;-

  • Venue:
  • Microelectronics Journal
  • Year:
  • 2013

Quantified Score

Hi-index 0.00

Visualization

Abstract

A wireless type of chip-to-chip communication (WCC) technology is proposed as the next generation of 3D semiconductor technology. To demonstrate the feasibility of this technology, we designed a coil, transmitter and receiver for wireless chip-to-chip communication using a 50-nm digital CMOS process. The coil is designed using inductive coupling with design parameters that include the number of turns, the metal width, and the space between adjacent metal lines. A differential transceiver structure is proposed for the WCC technology. The transmitter of the transceiver acts as a termination and bias circuit for the receiver while the transceiver is operating as a receiver. The receiver is designed with a typical differential amplifier and a latch to recover the transmitted original digital signal. The proposed transceiver and coil for the proposed WCC technology is implemented using commercial 50-nm digital CMOS technology. Experimental results successfully demonstrate the feasibility of the WCC technology.