Microwave engineering using microstrip circuits
Microwave engineering using microstrip circuits
Combined BEM/FEM substrate resistance modeling
Proceedings of the 39th annual Design Automation Conference
Layout impact of resolution enhancement techniques: impediment or opportunity?
Proceedings of the 2003 international symposium on Physical design
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A new exact formula to determine the substrate resistance and capacitance is presented in this work. It is derived from the solution of the Laplace equations for equivalent problems. It achieves the level of accuracy of standard electromagnetic methods while it is orders of magnitude faster than them. Equations for both rectangular and non-rectangular shapes of interconnect lines which apply to sub-micron technologies are presented. Both data from commercial simulators and measurement data obtained from a fabricated test chip are utilized in order to show the validity of the proposed formula. The results show that the proposed formula succeeds in computing the substrate's resistive and capacitive coupling.