Signal degradation through module pins in VLSI packaging

  • Authors:
  • Ching-Chao Huang;Leon Li-Heng Wu

  • Affiliations:
  • IBM General Technology Division, Hopewell Junction, NY;IBM General Technology Division, Hopwell Junction, NY

  • Venue:
  • IBM Journal of Research and Development
  • Year:
  • 1987

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Abstract