MEMS fault model generation using CARAMEL
ITC '98 Proceedings of the 1998 IEEE International Test Conference
Extraction and LVS for mixed-domain integrated MEMS layouts
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
Analysis of Failure Sources in Surface-Micromachined MEMS
ITC '00 Proceedings of the 2000 IEEE International Test Conference
A CAD tool for RF MEMS devices
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
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This article presents a design flow for integrated microelectromechanical systems (MEMS), with particular focus on electromechanical single-chip devices. The flow includes steps for both sensor and circuit design, and also addresses the issues of sensor-circuit interaction. The importance of packaging in a MEMS design flow is covered. Three practical examples based on inertial-sensor technology illustrate several steps in the flow, namely the mechanical schematic, the layout simulation, and package interaction. In the case of package interaction, experimental results are presented.