Structured design of microelectromechanical systems
DAC '97 Proceedings of the 34th annual Design Automation Conference
Microsystems testing: an approach and open problems
Proceedings of the conference on Design, automation and test in Europe
Development of a MEMS Testing Methodology
Proceedings of the IEEE International Test Conference
Failure modes for stiction in surface-micromachined MEMS
ITC '98 Proceedings of the 1998 IEEE International Test Conference
Defect-Oriented Experiments in Fault Modelling and Fault Simulation of Microsystem Components
EDTC '96 Proceedings of the 1996 European conference on Design and Test
Fault characterization of standard cell libraries using inductive contamination
VTS '96 Proceedings of the 14th IEEE VLSI Test Symposium
A fault simulation methodology for MEMS
DATE '00 Proceedings of the conference on Design, automation and test in Europe
Test and Testability of a Monolithic MEMS for Magnetic Field Sensing
Journal of Electronic Testing: Theory and Applications
A Design Flow for Micromachined Electromechanical Systems
IEEE Design & Test
Analysis of Failure Sources in Surface-Micromachined MEMS
ITC '00 Proceedings of the 2000 IEEE International Test Conference
Particulate Failures for Surface-Micromachined MEMS
ITC '99 Proceedings of the 1999 IEEE International Test Conference
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
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We have enhanced the process simulator CODEF[2] into a tool called CARAMEL (ContaminationAnd Reliability Analysis of MicroElectromechanicalLayout) for analyzing the impact of contamination particles on the geometrical and material properties of microelectromechanical systems (MEMS).CARAMEL accepts as input a microelectromechanicallayout, a particulate description, and a process recipe.CARAMEL produces a mesh description of the defective layout that is completely compatible with theelectromechanical simulator ABAQUS [31]. Analysisof CARAMEL's output indicates that a wide range ofdefective structures are possible due to the presence ofcontaminations. Moreover, electromechanical simulations of CARAMEL's mesh representations of defective layout has revealed that a wide variety of faultybehaviors are associated with these defects. In this paper, we describe CARAMEL and its application to thedevelopment of realistic fault models for MEMS.