High-Level Fault Modeling in Surface-Micromachined MEMS
Analog Integrated Circuits and Signal Processing
Test and Testability of a Monolithic MEMS for Magnetic Field Sensing
Journal of Electronic Testing: Theory and Applications
Generation of Electrically Induced Stimuli for MEMS Self-Test
Journal of Electronic Testing: Theory and Applications
MEMS fault model generation using CARAMEL
ITC '98 Proceedings of the 1998 IEEE International Test Conference
Analysis of Failure Sources in Surface-Micromachined MEMS
ITC '00 Proceedings of the 2000 IEEE International Test Conference
ITC '00 Proceedings of the 2000 IEEE International Test Conference
IMEMS Accelerometer Testing - Test Laboratory Development and Usage
ITC '99 Proceedings of the 1999 IEEE International Test Conference
Multi-Modal Built-In Self-Test for Symmetric Microsystems
VTS '04 Proceedings of the 22nd IEEE VLSI Test Symposium
Electro-thermal Stimuli for MEMS Testing in FSBM Technology
Journal of Electronic Testing: Theory and Applications
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
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Wafer-level testing of surface-micromachined sensors provides new challenges to the test community.Currently, there is no method available for performingdirect measurements to assess faulty micromechanicalstructures. Most commercial methods use electricalmeasurements to deduce the physical source of failures in the micromechanical structure. As a result, theprocess of identifying various failure modes (electricalmeasurements) and accurately mapping them to theunderlying physical failure mechanisms of the mechanical sensor becomes highly complex. Several sources offailures that include particulates and stiction complicate the situation even more. Here, we provide a casestudy of the Analog Devices ADXL75 Accelerometer.One failure category called stuck/tipped beams is investigated and a methodology is developed to uniquelydistinguish failures either caused by stuck or tippedbeams. The proposed method is easy to implement andthe information obtained can be critical for yield improvement.