Overview of microelectromechanical systems and design processes
DAC '97 Proceedings of the 34th annual Design Automation Conference
The broad sweep of integrated microsystems
IEEE Spectrum
Towards design and validation of mixed-technology SOCs
GLSVLSI '00 Proceedings of the 10th Great Lakes symposium on VLSI
On the Integration of Design and Test for Chips Embedding MEMS
IEEE Design & Test
Development of a MEMS Testing Methodology
Proceedings of the IEEE International Test Conference
Failure modes for stiction in surface-micromachined MEMS
ITC '98 Proceedings of the 1998 IEEE International Test Conference
Failure mechanisms and fault classes for CMOS-compatible microelectromechanical systems
ITC '98 Proceedings of the 1998 IEEE International Test Conference
Fault modeling of suspended thermal MEMS
ITC '99 Proceedings of the 1999 IEEE International Test Conference
On-Chip Pseudorandom MEMS Testing
Journal of Electronic Testing: Theory and Applications
Pseudorandom functional BIST for linear and nonlinear MEMS
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Electro-thermal Stimuli for MEMS Testing in FSBM Technology
Journal of Electronic Testing: Theory and Applications
Built-in-self-test techniques for MEMS
Microelectronics Journal
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
Pseudorandom BIST for test and characterization of linear and nonlinear MEMS
Microelectronics Journal
Study of an Electrical Setup for Capacitive MEMS Accelerometers Test and Calibration
Journal of Electronic Testing: Theory and Applications
Journal of Electronic Testing: Theory and Applications
Journal of Electronic Testing: Theory and Applications
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A major task for the implementation of Built-In-Self-Test (BIST) strategies for MEMS is the generation of the test stimuli. These devices can work in different energy domains and are thus designed to sense signals which are generally not electrical. In this work, we describe, for different types of MEMS, how the required non-electrical test stimuli can be induced on-chip by means of electrical signals. This provides the basis for adding BIST strategies for MEMS parts embedded in the coming generation of integrated systems. The on-chip test signal generation is illustrated for the case of MEMS transducers which exploit such physical principles as time-varying electrostatic capacitance, piezo-resistivity effect and Seebeck effect. These principles are used in devices such as accelerometers, infrared imagers, pressure sensors or tactile sensors. For implementation, we have used two major MEMS technologies including CMOS-compatible bulk micromachining and surface micromachining. We illustrate the ability to generate on-chip test stimuli and to implement a self-test strategy for the case of a complete application. This corresponds to an infrared imager that can be used in multiple applications such as overheating detection, night vision, and earth tracking for satellite positioning. The imager consists of an array of thermal pixels that sense an infrared radiation. Each pixel is implemented as a suspended membrane that contains several thermopiles along the different support arms. The on-chip test signal generation proposed requires only slight modifications and allows a production test of the imager with a standard test equipment, without the need of special infrared sources and the associated optical equipment. The test function can also be activated off-line in the field for validation and maintenance purposes.