High-Level Fault Modeling in Surface-Micromachined MEMS
Analog Integrated Circuits and Signal Processing
Failure modes for stiction in surface-micromachined MEMS
ITC '98 Proceedings of the 1998 IEEE International Test Conference
T7: MEMS: Technology, Design, CAD and Applications
ASP-DAC '02 Proceedings of the 2002 Asia and South Pacific Design Automation Conference
Analysis of Failure Sources in Surface-Micromachined MEMS
ITC '00 Proceedings of the 2000 IEEE International Test Conference
Built-In Self Test of CMOS-MEMS Accelerometers
ITC '02 Proceedings of the 2002 IEEE International Test Conference
Electrically Induced Stimuli For MEMS Self-Test
VTS '01 Proceedings of the 19th IEEE VLSI Test Symposium
Particulate Failures for Surface-Micromachined MEMS
ITC '99 Proceedings of the 1999 IEEE International Test Conference
My Tai-Chi book: a virtual-physical social network platform
Proceedings of the 9th ACM/IEEE International Conference on Information Processing in Sensor Networks
IEEE Spectrum
Specification Test Compaction for Analog Circuits and MEMS
Proceedings of the conference on Design, Automation and Test in Europe - Volume 1
Concurrent testing of digital microfluidics-based biochips
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Multiple fault diagnosis in digital microfluidic biochips
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Built-in-self-test techniques for MEMS
Microelectronics Journal
Testing and Diagnosis of Realistic Defects in Digital Microfluidic Biochips
Journal of Electronic Testing: Theory and Applications
Efficient parallel testing and diagnosis of digital microfluidic biochips
ACM Journal on Emerging Technologies in Computing Systems (JETC)
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
Pseudorandom BIST for test and characterization of linear and nonlinear MEMS
Microelectronics Journal
Study of an Electrical Setup for Capacitive MEMS Accelerometers Test and Calibration
Journal of Electronic Testing: Theory and Applications
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A mathematical model analyzing the efficacy of a built-inself-test technique, applicable to any symmetrical MEMS microstructure,is developed. The model predicts that the BISTtechnique can also be used to characterize a wide range of localmanufacturing variations affecting different regions of thedevice. Model predictions have been validated by simulation.Specifically, it has been shown that by using a suitable modulationscheme, sensitivity to linear etch variation along a particulardirection is improved by nearly 30%.