Multi-Modal Built-In Self-Test for Symmetric Microsystems
VTS '04 Proceedings of the 22nd IEEE VLSI Test Symposium
A Dual-Mode Built-In Self-Test Technique for Capacitive MEMS Devices
VTS '04 Proceedings of the 22nd IEEE VLSI Test Symposium
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
A Parallel Tester Architecture for Accelerometer and Gyroscope MEMS Calibration and Test
Journal of Electronic Testing: Theory and Applications
Electrical calibration of spring-mass MEMS capacitive accelerometers
Proceedings of the Conference on Design, Automation and Test in Europe
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A major problem for applying self-test techniques to MEMS is the multi-domain nature of the sensing parts that require special test equipment for stimuli generation. In this work we describe, for three different types of MEMS that work in different energy domains, how the required non-electrical test stimuli can be induced on-chip by means of electrical signals. This provides the basis for adding BIST strategies for MEMS parts embedded in the coming generation of integrated systems. The first case corresponds to an accelerometer as a review of a classical example. The last two cases correspond to piezoresistive and infrared sensors that we use in innovative applications under development in our Laboratory, and for which the self-test methods are new to our knowledge. The last case is also illustrated as a complete application that corresponds to an infrared imager. The on-chip test signal generation proposed requires only slight modifications and allows a production test of the imager with a standard test equipment, without the need of special infrared sources and the associated optical equipment. The test function can also be activated off-line in the field for validation and maintenance purposes.