Design of ICs for Flip-Chip Integration with Optoelectronic Device Arrays

Authors:
F. Kiamilev;R. Rosier;A. Krishnamoorthy;J. Rieve;C. Hull;R. Farbarik;R. Oettel;G. Aplin
Affiliations:
-;-;-;-;-;-;-;-
Venue:
MCMC '97 Proceedings of the 1997 Conference on IEEE Multi-Chip Module Conference
Year:
1997

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Abstract

Hybrid integration of optoelectronic devices, such as GaAs MQW modulators, to CMOS VLSI circuits provides the opportunity to design ICs that integrate millions of transistors and thousands of high-speed optical I/Os for high-performance computing and switching applications. One of the challenges in designing such large-scale ICs lies in the development of an efficient method for integrating existing VLSI circuit layouts with two-dimensional arrays of optoelectronic devices. This paper presents several such methods and describes their application.