Power Supply Transient Signal Analysis Under Real Process and Test Hardware Models

Authors:
Abhishek Singh;Jim Plusquellic;Anne Gattiker
Affiliations:
-;-;-
Venue:
VTS '02 Proceedings of the 20th IEEE VLSI Test Symposium
Year:
2002

Citing 0
Cited 3

IDDX-based test methods: A survey

ACM Transactions on Design Automation of Electronic Systems (TODAES)
Path Delay Estimation using Power Supply Transient Signals: A Comparative Study using Fourier and Wavelet Analysis

Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
A novel wavelet transform-based transient current analysis for fault detection and localization

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

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Abstract

A device testing method called Transient Signal Analysis (TSA) is subjected to elements of a real process and testing environment in this paper. Simulations experiments are designed to determine the effects of process skew (obtained from measured parameters f a real process) on the accuracy of TSA in estimating path delays from power supply IDDT and VDDT waveforms. The circuit model is designed to test TSA under deep submicron process models that incorporate advanced parameters such as transistor Vt width dependencies.Modeling elements of a testing environment including the probe card are subsequently introduced as a means of evaluating the effects of tester measurement noise in an actual implementation.