Substrate coupling in digital circuits in mixed-signal smart-power systems

  • Authors:
  • Radu M. Secareanu;Scott Warner;Scott Seabridge;Cathie Burke;Juan Becerra;Thomas E. Watrobski;Christopher Morton;William Staub;Thomas Tellier;Ivan S. Kourtev;Eby G. Friedman

  • Affiliations:
  • Motorola, Inc., SPS/Digital DNA Laboratories, Tempe, AZ;Xerox Corporation, Ink Jet Supplies Business Unit, Webster, NY;Xerox Corporation, Ink Jet Supplies Business Unit, Webster, NY;Xerox Corporation, Ink Jet Supplies Business Unit, Webster, NY;Xerox Corporation, Ink Jet Supplies Business Unit, Webster, NY;Xerox Corporation, Ink Jet Supplies Business Unit, Webster, NY;Xerox Corporation, Ink Jet Supplies Business Unit, Webster, NY;Xerox Corporation, Ink Jet Supplies Business Unit, Webster, NY;Xerox Corporation, Ink Jet Supplies Business Unit, Webster, NY;Department of Electrical Engineering, University of Pittsburgh, Pittsburgh, PA;University of Rochester, Department of Electrical and Computer Engineering, Rochester, NY

  • Venue:
  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • Year:
  • 2004

Quantified Score

Hi-index 0.00

Visualization

Abstract

This paper describes theoretical and experimental data characterizing the sensitivity of nMOS and CMOS digital circuits to substrate coupling in mixed-signal, smart-power systems. The work presented here focuses on the noise effects created by high-power analog circuits and affecting sensitive digital circuits on the same integrated circuit. The sources and mechanism of the noise behavior of such digital circuits are identified and analyzed. The results are obtained primarily from a set of dedicated test circuits specifically designed, fabricated, and evaluated for this work. The conclusions drawn from the theoretical and experimental analyses are used to develop physical and circuit design techniques to mitigate the substrate noise problems. These results provide insight into the noise immunity of digital circuits with respect to substrate coupling.