High-level simulation of substrate noise in high-ohmic substrates with interconnect and supply effects

  • Authors:
  • G. Van der Plas;M. Badaroglu;G. Vandersteen;P. Dobrovolny;P. Wambacq;S. Donnay;G. Gielen;H. De Man

  • Affiliations:
  • IMEC, Leuven, Belgium;IMEC, Leuven, Belgium and K.U. Leuven, Belgium;IMEC, Leuven, Belgium and Vrije Universiteit Brussel, Belgium;IMEC, Leuven, Belgium;IMEC, Leuven, Belgium and Vrije Universiteit Brussel, Belgium;IMEC, Leuven, Belgium;K.U. Leuven, Belgium;IMEC, Leuven, Belgium and K.U. Leuven, Belgium

  • Venue:
  • Proceedings of the 41st annual Design Automation Conference
  • Year:
  • 2004

Quantified Score

Hi-index 0.00

Visualization

Abstract

Substrate noise is a major obstacle for mixed-signal integration. In this paper we propose a fast and accurate high-level methodology to simulate substrate noise generated by large digital circuits. The methodology can handle any substrate type, e.g. bulk-type or EPI-type, and takes into account the effects of interconnect and supply. For each standard cell a substrate macromodel is used in order to efficiently simulate the total system, which consists of a network of such macromodels. For a 40K gates telecom circuit fabricated in a 0.18 mm CMOS process, measurements indicate that substrate noise is simulated by using our methodology within 20% error but several orders of magnitude faster in CPU time than a full SPICE simulation..