Damascene Copper electroplating for chip interconnections

Authors:
P. C. Andricacos;C. Uzoh;J. O. Dukovic;J. Horkans;H. Deligianni
Affiliations:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York;IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York;IBM Research Divsion, Thomas J. Watson Research Center, P. O. Box 218, Yorktown Heights, New York;IBM Research Divsion, Thomas J. Watson Research Center, P. O. Box 218, Yorktown Heights, New York;IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York
Venue:
IBM Journal of Research and Development - Electrochemical microfabrication
Year:
1998

Citing 1
Cited 6

VLSI on-chip interconnection performance simulations and measurements

IBM Journal of Research and Development

The chemistry of additives in damascene copper plating

IBM Journal of Research and Development - Electrochemical technology in microelectronics
Design and modeling of equipment used in electrochemical processes for microelectronics

IBM Journal of Research and Development - Electrochemical technology in microelectronics
Solving partial differential equations on irregular domains with moving interfaces, with applications to superconformal electrodeposition in semiconductor manufacturing

Journal of Computational Physics
High aspect ratio copper through-silicon-vias for 3D integration

Microelectronic Engineering
Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias

Microelectronic Engineering
The effect of tungsten and boron on the Cu barrier and oxidation properties of thin electroless cobalt-tungsten-boron films

Microelectronic Engineering

Quantified Score

Hi-index	0.01

Visualization

Abstract

Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 1990s, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creating a void or seam, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievable with conformal step coverage. This attribute of superconformal deposition, which we call superfilling, and its relation to plating additives are discussed, and we present a numerical model that represents the shape-change behavior of this system.