Evaluation of Signature-Based Testing of RF/Analog Circuits

Authors:
Amir Zjajo;Jose Pineda de Gyvez
Affiliations:
Philips Research Laboratories;Philips Research Laboratories
Venue:
ETS '05 Proceedings of the 10th IEEE European Symposium on Test
Year:
2005

Citing 0
Cited 3

Structural Fault Modeling and Fault Detection Through Neyman-Pearson Decision Criteria for Analog Integrated Circuits

Journal of Electronic Testing: Theory and Applications
Fault Coverage on RF VCOs and BIST for Wafer Sort Using Peak-to-Peak Voltage Detectors

Journal of Electronic Testing: Theory and Applications
Survey of Robustness Enhancement Techniques for Wireless Systems-on-a-Chip and Study of Temperature as Observable for Process Variations

Journal of Electronic Testing: Theory and Applications

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Abstract

Due to its low cost, low test time and reduced test complexity, structural testing is preferred to functional whenever possible. The study presented in this paper indicates that the two low-frequency structural test methods considered, power supply current monitoring and the power supply ramping technique, provide a valuable supplement/alternative when one of the functional tests (gain, noise figure and total harmonic distortion) in the test set can be complemented or substituted by structural test and add to or maintain no loss of fault coverage.