Quiescent-Signal Analysis: A Multiple Supply Pad IDDQ Method
IEEE Design & Test
Power supply signal calibration techniques for improving detection resolution to hardware Trojans
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
Detecting Trojans through leakage current analysis using multiple supply pad IDDQS
IEEE Transactions on Information Forensics and Security
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The power supply transient signal (I_DDT) method that we propose for defect detection analyzes regional signal variations introduced by defects at a set of power supply pads on the chip under test (CUT). The method is based on the comparison of the CUT with chips that are known to be defect free. A set of defect free chips are analyzed to establish a statistical metric that distinguishes between defect effects and process variation (defect free) effects. This paper presents hardware results that demonstrate the effectiveness of a novel geometry based defect detection technique using nine copies of a test chip. Eight chips are used as defect free chips to derive the statistical limits. Emulated defects are provoked in the ninth chip to evaluate the defect detection capabilities of the method.