Leveraging Wire Properties at the Microarchitecture Level

  • Authors:
  • Rajeev Balasubramonian;Naveen Muralimanohar;Karthik Ramani;Liqun Cheng;John B. Carter

  • Affiliations:
  • University of Utah;University of Utah;University of Utah;University of Utah;University of Utah

  • Venue:
  • IEEE Micro
  • Year:
  • 2006

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Abstract

In future microprocessors, communication will emerge as the major bottleneck. The authors advocate composing future interconnects of some wires that minimize latency, some that maximize bandwidth, and some that minimize power. A microarchitecture aware of these wire characteristics can steer on-chip data transfers to the most appropriate wires, thus improving performance and saving energy.