Optimal positions of twists in global on-chip differential interconnects

Authors:
Eisse Mensink;Daniël Schinkel;Eric A. M. Klumperink;Ed van Tuijl;Bram Nauta
Affiliations:
University of Twente, Enschede, The Netherlands;University of Twente, Enschede, The Netherlands;University of Twente, Enschede, The Netherlands;University of Twente, Enschede, The Netherlands;University of Twente, Enschede, The Netherlands
Venue:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Year:
2007

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Abstract

Crosstalk limits the achievable data rate of global on-chip interconnects on large CMOS ICs. This is especially the case, if low-swing signaling is used to reduce power consumption. Differential interconnects provide a solution for most crosstalk and noise sources, but not for neighbor-to-neighbor crosstalk in a data bus. This neighbor-to-neighbor crosstalk can be reduced with twists in the differential interconnect pairs. To reduce via resistance and metal layer use, we use as few twists as possible by placing only one twist in every even interconnect pair and only two twists in every odd interconnect pair. Analysis shows that there are optimal positions for the twists, which depend on the termination impedances of the interconnects. Theory and measurements on a 10-mm-long bus in 0.13-µm CMOS show that only one twist at 50% of the even interconnect pairs, two twists at 30% and 70% of the odd interconnect pairs, and both a low-ohmic source and a low-ohmic load impedance are very effective in mitigating the crosstalk.