Wrapper and TAM co-optimization for reuse of SoC functional interconnects

  • Authors:
  • Tomokazu Yoneda;Hideo Fujiwara

  • Affiliations:
  • Nara Institute of Science and Technology, Kansai Science City, Japan;Nara Institute of Science and Technology, Kansai Science City, Japan

  • Venue:
  • Proceedings of the conference on Design, automation and test in Europe
  • Year:
  • 2008

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Abstract

This paper presents a wrapper and TAM co-optimization method for reuse of SoC functional interconnects to minimize test time under area constraint. The proposed method consists of (1) an ILP formulation for wrapper and transparent TAM co-optimization, and (2) a simulated annealing based heuristic approach to reduce the computational cost of the proposed ILP model. Experimental results show the effectiveness of the proposed methods compared to the previous transparency-based TAM approaches and the conventional dedicated test bus approaches.