Interchangeable pin routing with application to package layout
Proceedings of the 1996 IEEE/ACM international conference on Computer-aided design
Efficient breakout routing in printed circuit boards
SCG '97 Proceedings of the thirteenth annual symposium on Computational geometry
Introduction to Algorithms
A routing algorithm for flip-chip design
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Layer minimization of escape routing in area array packaging
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
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This paper proposes a scheme for automatic re-distribution layer (RDL) routing, which is used in chip-package connections. Traditional RDL routing designs are mostly performed manually because the wire geometries are more flexible and therefore more difficult to handle on RDL than on chip. For example, octilinear routing is manufacturable in RDL and is widely adopted due to its higher efficiency than Manhattan routing. In this paper we devise a polynomial time octilinear RDL routing algorithm based on a grid network embedded in the bump array. The grid network is constructed to fully utilize the routing space as well as avoid any spacing violation. Detailed routing solution can be obtained following the min-cost max-flow in the network. Experimental results show the effectiveness of our router.