Layer minimization of escape routing in area array packaging

Authors:
Renshen Wang;Rui Shi;Chung-Kuan Cheng
Affiliations:
University of California, San Diego La Jolla, CA;University of California, San Diego La Jolla, CA;University of California, San Diego La Jolla, CA
Venue:
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Year:
2006

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Abstract

We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. The triangular patterns are generated in a reverse order from the last to the first layer. We demonstrate that the triangular pin sequence maximizes the sum of escape pins in the accumulated layers and thus minimize the number of escape routing layers. A test case is presented to illustrate the approach.