A logic design structure for LSI testability
DAC '77 Proceedings of the 14th Design Automation Conference
Automatic checking of logic design structures For compliance with testability ground rules
DAC '77 Proceedings of the 14th Design Automation Conference
Test generation for large logic networks
DAC '77 Proceedings of the 14th Design Automation Conference
An Algorithm for Testing Random Access Memories
IEEE Transactions on Computers
The Bidirectional Double Latch (BDDL)
IEEE Transactions on Computers
| Hi-index | 0.01 |
The high-density circuitry and I/O pin population of the thermal conduction module (TCM), the VLSI package used in the IBM 3081 processor models, dictates that there be a precise and cost-effective method of detecting and diagnosing TCM defects. This paper describes the challenge faced in testing the logic and random access memories of the TCM and the diagnostic approach used in the LT1280 test system for testing the TCM through its I/O pins. The generation and application of tests are discussed, and the automated multiple-defect diagnostic (AMDD) algorithm is presented in detail.