On Boosting the Accuracy of Non-RF to RF Correlation-Based Specification Test Compaction

  • Authors:
  • Nathan Kupp;Petros Drineas;Mustapha Slamani;Yiorgos Makris

  • Affiliations:
  • Department of Electrical Engineering, Yale University, New Haven, USA 06520;Department of Computer Science, Rensselaer Polytechnic Institute, Troy, USA 12180;IBM, Wireless Test Development Group, Essex Junction, USA 05452;Department of Electrical Engineering, Yale University, New Haven, USA 06520

  • Venue:
  • Journal of Electronic Testing: Theory and Applications
  • Year:
  • 2009

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Abstract

Several existing methodologies have leveraged the correlation between the non-RF and the RF performances of a circuit in order to predict the latter from the former and, thus, reduce test cost. While this form of specification test compaction eliminates the need for expensive RF measurements, it also comes at the cost of reduced test accuracy, since the retained non-RF measurements and pertinent correlation models do not always suffice for adequately predicting the omitted RF measurements. To alleviate this problem, we explore several methodologies that estimate the confidence in the obtained test outcome. Subsequently, devices for which this confidence is insufficient are retested through the complete specification test suite. As we demonstrate on production test data from a zero-IF down-converter fabricated at IBM, the proposed methodologies overcome the inability of standard specification test compaction methods to reach industrially acceptable test quality levels, and enable efficient exploration of the tradeoff between test accuracy and test cost.