Framework for massively parallel testing at wafer and package test

  • Authors:
  • A. Hakan Baba;Kee Sup Kim

  • Affiliations:
  • Stanford University;Intel Corporation

  • Venue:
  • ICCD'09 Proceedings of the 2009 IEEE international conference on Computer design
  • Year:
  • 2009

Quantified Score

Hi-index 0.00

Visualization

Abstract

A novel DFT approach is introduced that enables massively parallel testing of logic devices at both wafer and package test. Parallelism is achieved by utilizing interconnection networks that are built onto a wafer probe or a tester interface unit. The financial benefits of this method in a realistic setting are also presented.