Optimization Methods for Post-Bond Testing of 3D Stacked ICs
Journal of Electronic Testing: Theory and Applications
Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost
Journal of Electronic Testing: Theory and Applications
Scheduling Tests for 3D Stacked Chips under Power Constraints
Journal of Electronic Testing: Theory and Applications
A DfT Architecture for 3D-SICs Based on a Standardizable Die Wrapper
Journal of Electronic Testing: Theory and Applications
Yield Improvement for 3D Wafer-to-Wafer Stacked Memories
Journal of Electronic Testing: Theory and Applications
Challenges and emerging solutions in testing TSV-based 2 1/2D- and 3D-stacked ICs
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
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The industry is preparing itself for three-dimensional stacked ICs (3D-SICs), a technology that promises heterogeneous integration with higher performance and lower power dissipation at a smaller footprint. Several 3D stacking approaches are under development. From a yield point of view, Die-to-Wafer (D2W) stacking seems the most favorable approach, due to the ability of Known Good Die stacking. Minimizing the test cost for such a stacking approach is a challenging task. Every manufactured chip has to be tested, and any tiny test saving per 3D-SIC impacts the overall cost, especially in high-volume production. This paper establishes a cost model for D2W SICs and investigates the impact of the test cost for different test flows. It first introduces a framework covering different test flows for 3D D2W ICs. Subsequently, it proposes a test cost model to estimate the impact of the test flow on the overall 3D-SIC cost. Our simulation results show that (a) test flows with pre-bond testing significantly reduce the overall cost, (b) a cheaper test flow does not necessary result in lower overall cost, (c) test flows with intermediate tests (performed during the stacking process) pay off, (d) the most cost-effective test flow consists of pre-bond tests and strongly depends on the stack yield, hence, adapting the test according the stack yield is the best approach to use.