Demystifying 3D ICs: The Pros and Cons of Going Vertical
IEEE Design & Test
Design space exploration for 3-D cache
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
3D-Integrated SRAM Components for High-Performance Microprocessors
IEEE Transactions on Computers
Test Challenges for 3D Integrated Circuits
IEEE Design & Test
On-Chip TSV Testing for 3D IC before Bonding Using Sense Amplification
ATS '09 Proceedings of the 2009 Asian Test Symposium
Testing TSV-based three-dimensional stacked ICs
Proceedings of the Conference on Design, Automation and Test in Europe
Test Cost Analysis for 3D Die-to-Wafer Stacking
ATS '10 Proceedings of the 2010 19th IEEE Asian Test Symposium
Journal of Electronic Testing: Theory and Applications
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One of the key challenges in 3D Stacked-ICs (3D-SIC) is to guarantee high product quality at minimal cost. Quality is mostly determined by the applied tests and cost trade-offs. Testing 3D-SICs is very challenging due to several additional test moments for the mid-bond stacks, i.e., partially created stacks. The key question that this paper answers is what is the best test flow to be used in order to optimize the overall cost while realizing the required quality? We first present a framework covering different test flows for 3D Die-to-Wafer (D2W) stacked ICs. Thereafter, we present a cost model that allows us to evaluate these test flows. The impact of different test flows on the overall 3D-SIC cost for several die yields and stack sizes are investigated; a breakdown of the cost into test, manufacturing and packaging cost is also provided. Our simulation results show that both the test cost and the overall cost in D2W stacking strongly depends on the selected test flow; test flows with pre-bond and mid-bond stacking tests (performed during the stacking process) show a higher test cost share, but significantly reduce the overall 3D-SIC cost.