A thermal-driven floorplanning algorithm for 3D ICs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Interconnect and Thermal-aware Floorplanning for 3D Microprocessors
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
A novel fixed-outline floorplanner with zero deadspace for hierarchical design
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Synthesis of networks on chips for 3D systems on chips
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
SunFloor 3D: a tool for networks on chip topology synthesis for 3D systems on chips
Proceedings of the Conference on Design, Automation and Test in Europe
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
Proceedings of the International Conference on Computer-Aided Design
CMP Fill Synthesis: A Survey of Recent Studies
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
A3MAP: Architecture-aware analytic mapping for networks-on-chip
ACM Transactions on Design Automation of Electronic Systems (TODAES) - Special section on verification challenges in the concurrent world
Hi-index | 0.00 |
In this paper, we propose the first chemical-mechanical polishing (CMP) aware application-specific three-dimensional (3D) network-on-chip (NoC) design that minimizes through-silicon-via (TSV) height variation, thus reduces its bonding failure, and meanwhile optimizes conventional NoC design objectives. Our 3D NoC design assigns cores to proper silicon layers, determines the 3D NoC topology, allocates routing paths, and then floorplans cores, routers and TSV arrays by a CMP-aware manner. The key idea behind this 3D NoC design flow is to determine the CMP-aware 3D NoC topology where TSV arrays with low and uniform metal density are inserted between adjacent layers. Experimental results show that our CMP-aware 3D NoC design can achieves lower TSV height variation, higher performance and lower power consumption than the previous state-of-the-art 3D NoC designs.