Provably good and practically efficient algorithms for CMP dummy fill
Proceedings of the 46th Annual Design Automation Conference
A novel wire-density-driven full-chip routing system for CMP variation control
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Dummy fill optimization for enhanced manufacturability
Proceedings of the 19th international symposium on Physical design
Density gradient minimization with coupling-constrained dummy fill for CMP control
Proceedings of the 19th international symposium on Physical design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
On linewidth-based yield analysis for nanometer lithography
Proceedings of the Conference on Design, Automation and Test in Europe
Chemical-mechanical polishing aware application-specific 3D NoC design
Proceedings of the International Conference on Computer-Aided Design
Journal of Intelligent Manufacturing
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We survey recent research and practice in the area of chemical-mechanical polishing (CMP) fill synthesis, in terms of both problem formulations and solution approaches. We review the CMP as the planarization technique of choice for multilevel very large-scale integration metallization processes. Post-CMP wafer topography varies according to pattern density. We review density-analysis methods and density-control objectives that are used in today's fill-synthesis algorithms. In addition, we discuss the concept of design-driven fill synthesis that seeks to optimize CMP fill with respect to objectives beyond mere density uniformity. Design-driven fill synthesis minimizes the impact of CMP fill on design performance and parametric yield while still satisfying the density criteria that are motivated by manufacturing models. We conclude with a discussion of where CMP fill synthesis may be naturally integrated within future design and manufacturing flows.