Influence of distance between adjacent tubes on SWCNT bundle interconnect delay and power dissipation

Authors:
Mayank Kumar Rai;Sankar Sarkar
Affiliations:
Department of Electronics and Communication Engineering, Thapar University, Patiala, India 147004;Department of Electronics & Computer Engineering, Indian Institute of Technology, Roorkee, India
Venue:
Journal of Computational Electronics
Year:
2013

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Abstract

Influence of separation between adjacent tubes of various lengths and tube diameters, on delay and power dissipation in single walled carbon nanotube (SWCNT) bundle interconnect has been analyzed. The results are compared with those of currently used copper interconnects at 22nm technology node. SPICE simulation results reveal that delay increases with an increase in the separation between adjacent tubes for the entire range of length values and tube diameters whereas the reverse is true for power dissipation.