Performance analysis of carbon nanotube interconnects for VLSI applications
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Are carbon nanotubes the future of VLSI interconnections?
Proceedings of the 43rd annual Design Automation Conference
On-Chip Communication Architectures: System on Chip Interconnect
On-Chip Communication Architectures: System on Chip Interconnect
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Proceedings of the 44th annual Design Automation Conference
NanoLab: a nanorobotic system for automated pick-and-place handling and characterization of CNTs
ICRA'09 Proceedings of the 2009 IEEE international conference on Robotics and Automation
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Microelectronics Journal
Nanoelectronics beyond silicon
Microelectronic Engineering
Expert Systems with Applications: An International Journal
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NANOARCH '09 Proceedings of the 2009 IEEE/ACM International Symposium on Nanoscale Architectures
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Journal of Computational Electronics
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Carbon nanotubes with their outstanding electrical and mechanical properties are suggested as an interconnect material of the future. In this paper we will introduce nanotubes, compare their electrical properties with equivalent metal wires made of gold and describe our progress in process integration. Multi-walled carbon nanotubes are grown on 6-inch wafers in a batch process. The resulting nanotubes are evaluated with respect to their conductance as single multiwalled nanotubes and in their implementation as interconnects in vias and contact holes.