Multichip Module Diagnosis by Product-Code Signatures

Authors:
P. Nagvajara;J. Lin;P. Nilagupta;C. Wang
Affiliations:
Department of Electrical and Computer Engineering, Drexel University Philadelphia, PA 19104/ E-mail: E.Prawat_Nagvajara@cbis.ece.drexel.edu;Department of Electrical and Computer Engineering, Drexel University Philadelphia, PA 19104/ E-mail: E.Prawat_Nagvajara@cbis.ece.drexel.edu;Department of Electrical and Computer Engineering, Drexel University Philadelphia, PA 19104/ E-mail: E.Prawat_Nagvajara@cbis.ece.drexel.edu;Department of Electrical and Computer Engineering, Drexel University Philadelphia, PA 19104/ E-mail: E.Prawat_Nagvajara@cbis.ece.drexel.edu
Venue:
Journal of Electronic Testing: Theory and Applications - Special issue on multi-chip testing and design for testability
Year:
1997

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Abstract

A system diagnosis technique for multichip module (MCM) ispresented. The proposed technique uses built-in probes for monitoringinternal responses and, with a signature analysis scheme based onerror correcting codes, identifies the probes where erroneous test responses have been detected. Conceptsfrom system diagnosis is used in conjunction withsignature analysis in developing the proposed MCM diagnosistechnique, where the resulting patterns of the faulty probes are usedin the identification of the faulty submodules (dies). The proposedtechnique offers a diagnostic capability in system functional test.