Techniques for including dielectrics when extracting passive low-order models of high speed interconnect

Authors:
Luca Daniel;Alberto Sangiovanni-Vincentelli;Jacob White
Affiliations:
University of California, Berkeley;Univ. of California, Berkeley;Massachusetts Institute of Technology
Venue:
Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
Year:
2001

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Abstract

Interconnect structures including dielectrics can be modeled by an integral equation method using volume currents and surface charges for the conductors, and volume polarization currents and surface charges for the dielectrics. In this paper we describe a mesh analysis approach for computing the discretized currents in both the conductors and the dielectrics. We then show that this fully mesh-based formulation can be cast into a form using provably positive semidefinite matrices, making for easy application of Krylovsubspace based model-reduction schemes to generate accurate guaranteed passive reduced-order models. Several printed circuit board examples are given to demonstrate the effectiveness of the strategy.