Innovative Built-In Self-Test Schemes for On-Chip Diagnosis, Compliant with the IEEE 1149.4 Mixed-Signal Test Bus Standard

  • Authors:
  • Gladys Omayra Ducoudray-Acevedo;Jaime Ramírez-Angulo

  • Affiliations:
  • Klipsch School of Electrical and Computer Engineering, New Mexico State University, Las Cruces, New Mexico 88003. gducoudr@nmsu.edu;Klipsch School of Electrical and Computer Engineering, New Mexico State University, Las Cruces, New Mexico 88003. jramirez@nmsu.edu

  • Venue:
  • Journal of Electronic Testing: Theory and Applications
  • Year:
  • 2003

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Abstract

This paper presents a testing scheme for analog and mixed-signal circuitry compatible with the IEEE 1149.4 mixed-signal test bus standard. A high-speed dynamic current sensor is described, as well as an innovative self-diagnostic method called VDDQ. The former is used to measure signature supply currents and to compare them with the footprint of a defect-free circuit. The latter senses the quiescent nodal voltages on several nodes of the circuit under test and compares them to their nominal values. A flag is raised if significant deviations are found. Simulation results are provided for the high-speed dynamic current sensor. Through simulations the VDDQ method has performed at one node test every half millisecond and has potential for much higher speed. It is faster than currently used methods in industry, which average to 5000 nodes per minute. This will potentially allow a defect-free IC to enter the market in significantly less time than with conventional testing methods.