Testing Defects in Scan Chains

  • Authors:
  • Manoj Sachdev

  • Affiliations:
  • -

  • Venue:
  • IEEE Design & Test
  • Year:
  • 1995

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Abstract

Applying scan-based DFT, I/sub DDQ/ testing, or both to sequential circuits does not ensure bridging-fault detection, which depends on the resistance of the fault and circuit level parameters. With a "transparent" scan chain, however, the tester can use both methods to detect manufacturing process defects effectively-including difficult-to-detect shorts in the scan chain. The author presents a strategy for making the scan chain transparent. The test complexity of such a chain is very small, regardless of the number of flip-flops it contains.