A new high-speed interconnect crosstalk fault model and compression for test space
WSEAS TRANSACTIONS on COMMUNICATIONS
A computer-aided design tool for the analysis of electrical-connector transmission lines
International Journal of Computer Applications in Technology
Test pattern generation for crosstalk fault of high-speed interconnect
ICC'08 Proceedings of the 12th WSEAS international conference on Circuits
A noise-aware design and an enhanced IBIS model for evaluating simultaneous switching noise
CSECS'09 Proceedings of the 8th WSEAS International Conference on Circuits, systems, electronics, control & signal processing
Methodology and experiences with embedded hardware development
ETFA'09 Proceedings of the 14th IEEE international conference on Emerging technologies & factory automation
PEEC based parasitic modeling for power analysis on custom rotary rings
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
A novel design for evaluating simultaneous switching noise within an enhanced IBIS model
WSEAS Transactions on Circuits and Systems
Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits
Microelectronics Journal
A 33mW 12.5Gbps BiCMOS transmitter for high speed backplane applications
Microelectronics Journal
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From the Publisher:The complete guide to understanding and designing for signal integrity Suitable for even non-specialists, Signal Integrity-Simplified offers a comprehensive, easy-to-follow look at how physical interconnects affect electrical performance. World-class engineer Eric Bogatin expertly reviews the root causes of the four families of signal integrity problems and offers solutions to design them out early in the design cycle. Coverage includes: * An introduction to signal integrity and physical design * A fundamental understanding of what bandwidth, inductance, and characteristic impedance really mean * Analysis of resistance, capacitance, inductance, and impedance * The four important practical tools used to solve signal integrity problems: rules of thumb, analytic approximations, numerical simulation, and measurements * The effect of the physical design of interconnects on signal integrity * Solutions that do not hide behind mathematical derivations * Recommendations for design guidelines to improve signal integrity, and much more Unlike related books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Specially designed for everyone in the electronics industry, from electrical engineers to product managers, Signal Integrity-Simplified will prove itself an invaluable resource for helping you find and fix signal integrity problems before they become problems. ABOUT THE AUTHORERIC BOGATIN, Chief Technology Officer at GigaTest Labs, has over 23 years of experience in the microelectronics industry. Before joining GigaTest, he worked with AT&T Bell Labs, Raychem Corporation, Sun Microsystems, and other leading microelectronics manufacturers. He received his B.S. degree in physics at MIT and his M.S. and Ph.D. degrees from the University of Arizona, Tucson, in 1980. Over the years, he has taught over 3,000 engineers and authored over 100 technical articles and books on signal integrity and interconnect design.