Proceedings of the IEEE International Test Conference
Modern Test Techniques: Tradeoffs, Synergies, and Scalable Benefits
Journal of Electronic Testing: Theory and Applications
Tackling Test Trade-offs from Design, Manufacturing to Market using Economic Modeling
ITC '01 Proceedings of the 2001 IEEE International Test Conference
On-Chip Test Infrastructure Design for Optimal Multi-Site Testing of System Chips
Proceedings of the conference on Design, Automation and Test in Europe - Volume 1
A test pattern ordering algorithm for diagnosis with truncated fail data
Proceedings of the 43rd annual Design Automation Conference
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This paper develops a Semiconductor TestEconomic Model that can easily be applied to loweringoverall cost of test and improving throughput. The"Model", designed to take the complexity out of TestEconomics, describes all the variables that make up CostPer Unit (CPU), and using managerial economicconcepts, illustrates how they interact with each other,as well as the overall production goal of minimizingcosts while maximizing throughput. This paper is writtenfor Test Managers, Test Engineers, Product Engineers,and ATE Capital Equipment Buyers for the purpose ofgaining insight analyzing test economics, in order tomake better decisions on everyday Manufacturing issuesrelated to: test time reduction, multisite testing, yield,handler index time, ATE Utilization, and ATEpurchasing.