SoC Test Scheduling with Power-Time Tradeoff and Hot Spot Avoidance
Proceedings of the conference on Design, automation and test in Europe - Volume 1
Rapid Generation of Thermal-Safe Test Schedules
Proceedings of the conference on Design, Automation and Test in Europe - Volume 2
FITS: An Integrated ILP-Based Test Scheduling Environment
IEEE Transactions on Computers
A retention-aware test power model for embedded SRAM
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
EUC'06 Proceedings of the 2006 international conference on Embedded and Ubiquitous Computing
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We present a test scheduling methodology for core-basedsystem-on-chips that allows tradeoff between system powerdissipation and overall test time. The basic strategy is to use thepower profile of non-embedded cores to find the best mix of theirtest pattern subsets that satisfy the power and/or timeconstraints. An MILP formulation is presented to globally performthe power-time tradeoff and produce the SoC test schedule. Manyconstraints including peak/average power of cores, time/sequencingrequirements, and ATE pin limitation are also incorporated withinthis formulation.