Prediction of interconnect adjacency distribution: derivation, validation, and applications

Authors:
Payman Zarkesh-Ha;Ken Doniger;William Loh;Peter Bendix
Affiliations:
LSI Logic Corporation, Milpitas, CA;LSI Logic Corporation, Milpitas, CA;LSI Logic Corporation, Milpitas, CA;LSI Logic Corporation, Milpitas, CA
Venue:
Proceedings of the 2004 international workshop on System level interconnect prediction
Year:
2004

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Abstract

An analytical interconnect adjacency distribution model for random logic interconnect networks based on the Bernoulli probability distribution is derived. By definition, interconnect adjacency is the fractional length of an interconnect for which there is a neighboring interconnect at minimum spacing. Some possible applications of the interconnect adjacency distribution are statistical cross-talk analysis, interconnect yield prediction, and statistical interconnect reference circuit for more realistic capacitance estimation.The model uses only simple and readily available system parameters well known to designers. These are the wire-length distribution and the average channel utilization. Comparison to product data shows good agreement with the model.