Spatially distributed 3D circuit models

  • Authors:
  • Michael Beattie;Hui Zheng;Anirudh Devgan;Byron Krauter

  • Affiliations:
  • IBM Corporation, Austin, TX;IBM Corporation, Austin, TX;IBM Corporation, Austin, TX;IBM Corporation, Austin, TX

  • Venue:
  • Proceedings of the 42nd annual Design Automation Conference
  • Year:
  • 2005

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Abstract

Spatially distributed 3D circuit models are extracted with a segment-to-segment BEM (Boundary Element Method) algorithm for both capacitance and inverse inductance couplings rather than using the traditional net-to-net approach. Critical issues regarding the extraction efficiency and accuracy of segment-to-segment BEM capacitance models are explored. An adaptive discretization scheme is developed for segment-to-segment capacitance extraction and also applied to segment-to-segment high-frequency inverse inductance extraction. We demonstrate the limitations of the duality between capacitance and inverse inductance. Examples demonstrating the accuracy of these models are presented for real packaging cases.