Shmoo Plotting: The Black Art of IC Testing
IEEE Design & Test
Resistance Characterization for Weak Open Defects
IEEE Design & Test
Very-Low-Voltage Testing for Weak CMOS Logic ICs
Proceedings of the IEEE International Test Conference on Designing, Testing, and Diagnostics - Join Them
Improving Diagnostic Resolution of Delay Faults using Path Delay Fault Model
VTS '03 Proceedings of the 21st IEEE VLSI Test Symposium
Comparison of IDDQ Testing and Very-Low Voltage Testing
ITC '02 Proceedings of the 2002 IEEE International Test Conference
Use of DFT Techniques In Speed Grading a 1GHz+ Microprocessor
ITC '02 Proceedings of the 2002 IEEE International Test Conference
On Hazard-free Patterns for Fine-delay Fault Testing
ITC '04 Proceedings of the International Test Conference on International Test Conference
Systematic Defects in Deep Sub-Micron Technologies
ITC '04 Proceedings of the International Test Conference on International Test Conference
LOW OVERHEAD DELAY TESTING OF ASICS
ITC '04 Proceedings of the International Test Conference on International Test Conference
Affordable and Effective Screening of Delay Defects in ASICs using the Inline Resistance Fault Model
ITC '04 Proceedings of the International Test Conference on International Test Conference
Hi-index | 0.00 |
The impact of test conditions on the detectability of open defects is investigated. We performed an inductive fault analysis on representative standard gates. The simulation results show that open-like defects result in a wide range of different voltage-delay dependencies, ranging from a strongly increasing to a strongly decreasing delay as a function of voltage. The behaviour is not only determined by the defect location but also by the test pattern. Knowing the expected behaviour of a certain defect location helps failure localisation. The detectability of a defect is strongly determined by the behaviour of the affected path as well as that of the longest path. Our simulations and measurements show that in general elevated supply voltages give a better detectability of open-like defects.