A modular simulation framework for architectural exploration of on-chip interconnection networks
Proceedings of the 1st IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
System-level communication modeling for network-on-chip synthesis
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Transaction-Level Modeling with Systemc: Tlm Concepts and Applications for Embedded Systems
Transaction-Level Modeling with Systemc: Tlm Concepts and Applications for Embedded Systems
Embedded software development on top of transaction-level models
CODES+ISSS '07 Proceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis
Accuracy-adaptive simulation of transaction level models
Proceedings of the conference on Design, automation and test in Europe
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
System-level bus-based communication architecture exploration using a pseudoparallel algorithm
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
TLM automation for multi-core design
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
A fast and effective dynamic trace-based method for analyzing architectural performance
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Automatic generation of high-speed accurate TLM models for out-of-order pipelined bus
ACM Transactions on Embedded Computing Systems (TECS) - Special Section on ESTIMedia'10
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In this paper we present a generic interconnect fabric for transaction level modelling tackeling three major aspects. First, a review of the bus and IO structures that we have analysed, which are common in todays system on chip environments, and require to be modelled at a transaction level. Second our findings in terms of the data structures and interface API's that are required in order to model those (and we believe other) busses and IO structures. Third the surrounding infrastructure that we believe can, and should be in place to support the modelling of those busses and IO structures. We will present the infrastructure that we have built, and indicate where our future work will hea.