Ultrathin nitrided gate dielectrics by plasma-assisted processing
INFOS'99 Proceedings of the 11th biennial conference on on Insulating films on semiconductors
Compatibility of Silicon gates with hafnium-based gate dielectrics
Microelectronic Engineering - Proceedings of the symposium and summer school on: Nano and Giga challenges in microelectronics research and opportunities in Russia
Microelectronic Engineering - Proceedings of the symposium and summer school on: Nano and Giga challenges in microelectronics research and opportunities in Russia
Charge trapping and detrapping in HfO2 high-k gate stacks
Microelectronic Engineering - Special issue: Proceedings of the 13th biennial conference on insulating films on semiconductors
Point defects in HfO2 high K gate oxide
Microelectronic Engineering - Proceedings of the 14th biennial conference on insulating films on semiconductors
Scaling the gate dielectric: materials, integration, and reliability
IBM Journal of Research and Development
Growth and characterization of ultrathin nitrided silicon oxide films
IBM Journal of Research and Development
Silicon CMOS devices beyond scaling
IBM Journal of Research and Development - Advanced silicon technology
Microelectronic Engineering
Nanometer device scaling in subthreshold circuits
Proceedings of the 44th annual Design Automation Conference
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Scaling the MOSFET gate dielectric: From high-k to higher-k? (Invited Paper)
Microelectronic Engineering
A discussion on SRAM circuit design trend in deeper nanometer-scale technologies
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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The paper reviews our recent progress and current challenges in implementing advanced gate stacks composed of high-κ dielectric materials and metal gates in mainstream Si CMOS technology. In particular, we address stacks of doped polySi gate electrodes on ultrathin layers of high-κ dielectrics, dual-workfunction metal-gate technology, and fully silicided gates. Materials and device characterization, processing, and integration issues are discussed.