Scaling trends of on-chip power distribution noise
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Noise Aware Decoupling Capacitors for Multi-Voltage Power Distribution Systems
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
Maximum effective distance of on-chip decoupling capacitors in power distribution grids
GLSVLSI '06 Proceedings of the 16th ACM Great Lakes symposium on VLSI
Decoupling capacitors for multi-voltage power distribution systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Power Distribution Networks with On-Chip Decoupling Capacitors
Power Distribution Networks with On-Chip Decoupling Capacitors
Decoupling capacitance allocation and its application to power-supply noise-aware floorplanning
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Optimal decoupling capacitor sizing and placement for standard-cell layout designs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Transition-aware decoupling-capacitor allocation in power noise reduction
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Analysis and reduction of supply noise fluctuations induced by embedded via-programming ROM
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Hi-index | 0.00 |
Decoupling capacitors are widely used to reduce power supply noise. On-chip decoupling capacitors have traditionally been allocated into the white space available on the die based on an unsystematic or ad hoc approach. In this way, large decoupling capacitors are often placed at a significant distance from the current load, compromising the signal integrity of the system. This issue of power delivery cannot be alleviated by simply increasing the size of the on-chip decoupling capacitors. To be effective, the on-chip decoupling capacitors should be placed physically close to the current loads. The area occupied by the on-chip decoupling capacitor, however, is directly proportional to the magnitude of the capacitor. The minimum impedance between the on-chip decoupling capacitor and the current load is therefore fundamentally affected by the magnitude of the capacitor. A distributed on-chip decoupling capacitor network is proposed in this paper. A system of distributed on-chip decoupling capacitors is shown to provide an efficient solution for providing the required on-chip decoupling capacitance under existing technology constraints. In a system of distributed on-chip decoupling capacitors, each capacitor is sized based on the parasitic impedance of the power distribution grid. Various tradeoffs in a system of distributed on-chip decoupling capacitors are also discussed. Related simulation results for typical values of on-chip parasitic resistance are also presented. An analytic solution is shown to provide accurate distributed system. The worst case error is 0.003% as compared to SPICE. Techniques presented in this paper are applicable not only for current technologies, but also provide an efficient placement of the on-chip decoupling capacitors in future technology generations.