Thinning Methodologies-A Comprehensive Survey
IEEE Transactions on Pattern Analysis and Machine Intelligence
The scientist and engineer's guide to digital signal processing
The scientist and engineer's guide to digital signal processing
Sequential Operations in Digital Picture Processing
Journal of the ACM (JACM)
Introduction to Algorithms
Fast optical and process proximity correction algorithms for integrated circuit manufacturing
Fast optical and process proximity correction algorithms for integrated circuit manufacturing
RADAR: RET-aware detailed routing using fast lithography simulations
Proceedings of the 42nd annual Design Automation Conference
Process variation aware OPC with variational lithography modeling
Proceedings of the 43rd annual Design Automation Conference
Mask Design for Optical Microlithography—An Inverse Imaging Problem
IEEE Transactions on Image Processing
Information theoretic modeling and analysis for global interconnects with process variations
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Line search-based inverse lithography technique for mask design
VLSI Design - Special issue on New Algorithmic Techniques for Complex EDA Problems
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As the 193nm lithography is likely to be used for 45mm and even 32nm processes, much more stringent requirement will be posed on Optical Proximity Correction (OPC) technologies. Currently, there are two OPC approaches --- the model-based OPC (MB-OPC) and the inverse lithography technology (ILT). MB-OPC generates masks which is less complex compared with IL.T. But IL.T produces much better results than MB-OPC in terms of contour fidelity because ILT is a pixel based method. Observing that MB-OPC preserves the mask shape topologies which leads to a lower mask complexity, we combine the strengths of both methods --- the topology invariant property and the pixel based mask representation. To the best of our knowledge, it is the first time that this topological invariant pixel based OPC (TIP-OPC) paradigm is proposed, which fills the critical hole of the OPC landscape and potentially has many new applications. Our technical novelty includes the lithography friendly mask topological invariant operations, the efficient Fast Fourier Transform based cost function sensitivity computation and the TIP-OPC algorithm. The experimental results show that TIP-OPC can achieve much better post OPC contours compared with MB-OPC while maintaining the mask shape topologies.