Testing semiconductor memories: theory and practice
Testing semiconductor memories: theory and practice
Design for Test: For Digital Integrated Circuits
Design for Test: For Digital Integrated Circuits
Realistic Built-In Self-Test for Static RAMs
IEEE Design & Test
Serial Interfacing for Embedded-Memory Testing
IEEE Design & Test
Design and Test of Large Embedded Memories: An Overview
IEEE Design & Test
Testing a System-On-a-Chip with Embedded Microprocessor
ITC '99 Proceedings of the 1999 IEEE International Test Conference
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We present a novel test architecture which combines IEEE 1149.1 Boundary-Scan with a Memory Built-In Self-Test. The TDI pin is used for serially shifting in the test data into a test data register which is connected to the memory. The finite state machine of the TAP controller performs the memory test algorithm. The test response is shifted out via the TDO pin for off-chip analyses. The test architecture offers small area overhead, acceptable test time, increased flexibility and analysis capabilities while maintaining compliance to the Boundary-Scan standard.