Design for burn-in test: a technique for burn-in thermal stability under die-to-die parameter variations

Authors:
Mesut Meterelliyoz;Kaushik Roy
Affiliations:
Purdue University, West Lafayette, IN;Purdue University, West Lafayette, IN
Venue:
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Year:
2009

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Abstract

Strong temperature dependence of leakage has been a major problem during burn-in test where increased voltages and temperatures are applied to weed out defective parts. Moreover, process variations may result in different temperature profiles in different dies during burn-in. This paper proposes an adaptive design-for-burn-in technique that stabilizes the junction temperature by controlling the leakage power using sleep (supply-gating) transistors for a wide range of ambient temperatures, process variations, thermal resistances and supply voltages.