Fundamentals of modern VLSI devices
Fundamentals of modern VLSI devices
An Introduction to VLSI Physical Design
An Introduction to VLSI Physical Design
Gate leakage reduction for scaled devices using transistor stacking
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
The effect of process variation on device temperature in FinFET circuits
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Design space exploration of FinFET cache
ACM Journal on Emerging Technologies in Computing Systems (JETC)
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In this work we propose a methodology to self-consistently solve leakage power with temperature to predict thermal runaway. We target 28n m FinFET based circuits as they are more prone to thermal runaway compared to bulk-MOSFETs. We generate thermal models for logic cells to self-consistently determine the temperature map of a circuit block. Our proposed condition for thermal runaway shows the design trade off between the primary input (PI) activity of a circuit block, sub-threshold leakage at the room temperature and the thermal resistance of the package. We show that in FinFET circuits, thermal runaway can occur at the ITRS specified sub-threshold leakage (150nA/μm, highperformance) for a nominal PI activity of 0.5 and typical package thermal resistance.