Leakage power dependent temperature estimation to predict thermal runaway in FinFET circuits

  • Authors:
  • Jung Hwan Choi;Aditya Bansal;Mesut Meterelliyoz;Jayathi Murthy;Kaushik Roy

  • Affiliations:
  • Purdue University, West Lafayette, IN;Purdue University, West Lafayette, IN;Purdue University, West Lafayette, IN;Purdue University, West Lafayette, IN;Purdue University, West Lafayette, IN

  • Venue:
  • Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
  • Year:
  • 2006

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Abstract

In this work we propose a methodology to self-consistently solve leakage power with temperature to predict thermal runaway. We target 28n m FinFET based circuits as they are more prone to thermal runaway compared to bulk-MOSFETs. We generate thermal models for logic cells to self-consistently determine the temperature map of a circuit block. Our proposed condition for thermal runaway shows the design trade off between the primary input (PI) activity of a circuit block, sub-threshold leakage at the room temperature and the thermal resistance of the package. We show that in FinFET circuits, thermal runaway can occur at the ITRS specified sub-threshold leakage (150nA/μm, highperformance) for a nominal PI activity of 0.5 and typical package thermal resistance.