Fundamentals of modern VLSI devices
Fundamentals of modern VLSI devices
Statistical estimation of leakage current considering inter- and intra-die process variation
Proceedings of the 2003 international symposium on Low power electronics and design
Thermal Management of High Performance Microprocessors
DFT '03 Proceedings of the 18th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems
Statistical Timing Analysis for Intra-Die Process Variations with Spatial Correlations
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Full-chip analysis of leakage power under process variations, including spatial correlations
Proceedings of the 42nd annual Design Automation Conference
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
Leakage power dependent temperature estimation to predict thermal runaway in FinFET circuits
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Modeling and Analysis of Leakage Currents in Double-Gate Technologies
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Low-power FinFET circuit synthesis using surface orientation optimization
Proceedings of the Conference on Design, Automation and Test in Europe
Proceedings of the 48th Design Automation Conference
Thermal Characterization of Test Techniques for FinFET and 3D Integrated Circuits
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Design space exploration of FinFET cache
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Process-Variation and Temperature Aware SoC Test Scheduling Technique
Journal of Electronic Testing: Theory and Applications
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With technology scaling, devices are increasingly prone to process variations. These variations cause a large spread in leakage power, since it is extremely sensitive to process variations, which in turn results in larger temperature variations across different dies. In this paper, we investigate the temperature variations in FinFET circuits considering variations in following parameters (i) channel length and (ii) body thickness. We estimate temperature variation under process fluctuation by Monte Carlo simulation with thermal models to solve temperature and leakage power self-consistently. The results show that high activity circuits exhibit larger temperature variations since increased temperature increments leakage power and vice versa. It is also shown that under moderate process variation (3σ=10% for channel length and body thickness) and a nominal primary input activity of 0.4, thermal runaway can occur in more than 15% of chips in 28nm FinFET technology, severely degrading manufacturing yield.